Low-compression-force gap-filler pads boost thermal efficiency of heat sinks

The compression characteristics of thermal gap fillers should be key considerations during a product's early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and fragile solder joints as the […] The post Low-compression-force gap-filler pads boost thermal efficiency of heat sinks appeared first on Electrical Engineeri...